QuadCore+ is Kingspan's patented second-generation PIR foam formulation. The precisely controlled cell structure achieves a thermal conductivity (λ) of just 0.020 W/mK — the lowest of any commercially produced rigid foam insulation at scale — enabling panels to achieve the same R-value in a thinner profile than conventional alternatives.
0.020
λ value W/mK
R-44
Max R-value (200mm)
EI 60
Fire resistance (standard)
PIR
Polyisocyanurate core
Where panel thickness is architecturally or structurally constrained, Kooltherm phenolic foam achieves thermal conductivity values as low as 0.018 W/mK — the highest performing mainstream insulation material available for slim-profile applications including pipe insulation, framing boards and composite cladding systems.
Kingspan's vacuum insulated panel (VIP) technology achieves thermal conductivity values of 0.007–0.008 W/mK — approximately five times better than standard PIR. A 25 mm VIP delivers the same thermal resistance as a 120 mm PIR board, making it the only viable solution for retrofit or space-critical refurbishment projects.
On-site solar and wind PPA contracts across all manufacturing facilities by 2030 target date.
PIR offcut recovery programme collects post-industrial foam waste and reprocesses it into re-bonded insulation products.
Every product carries an independently verified Environmental Product Declaration enabling precise whole-life carbon calculations.
Top 1% rating across environment, ethics, labour and sustainable procurement in independent EcoVadis annual assessment.
